Traducción y análisis de palabras por inteligencia artificial ChatGPT
En esta página puede obtener un análisis detallado de una palabra o frase, producido utilizando la mejor tecnología de inteligencia artificial hasta la fecha:
- cómo se usa la palabra
- frecuencia de uso
- se utiliza con más frecuencia en el habla oral o escrita
- opciones de traducción
- ejemplos de uso (varias frases con traducción)
- etimología
Qué (quién) es Plastic Flat Package - definición
.jpg?width=200 "144-pin low profile quad flat package (LQFP)")
![80-pin thin quad flat package (TQFP) – [[PIC microcontroller]]](https://commons.wikimedia.org/wiki/Special:FilePath/PIC18F8720.jpg?width=200 "80-pin thin quad flat package (TQFP) – [[PIC microcontroller]]")
![thermal pad]] (TP)](https://commons.wikimedia.org/wiki/Special:FilePath/Sega 304-pin QFP.jpg?width=200 "thermal pad]] (TP)")
![100-pin bumpered quad flat package (BQFP) – [[Cyrix Cx486SLC]]](https://commons.wikimedia.org/wiki/Special:FilePath/Cyrix Cx486SLCe-V25MP DF7339E top.jpg?width=200 "100-pin bumpered quad flat package (BQFP) – [[Cyrix Cx486SLC]]")
![ST6 microcontroller]]](https://commons.wikimedia.org/wiki/Special:FilePath/CRQFP80 UV ST62E40.jpg?width=200 "ST6 microcontroller]]")
Wikipedia
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).
The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB).
A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components.
